A demystifying study of thermal relief pads - IEEE Xplore

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Abstract: Thermal relief is a technique used by printed circuit board (PCB) designers to thermally decouple soldering pads from large copper areas, ... SkiptoMainContent IEEEAccount ChangeUsername/Password UpdateAddress PurchaseDetails PaymentOptions OrderHistory ViewPurchasedDocuments ProfileInformation CommunicationsPreferences ProfessionandEducation TechnicalInterests NeedHelp? US&Canada:+18006784333 Worldwide:+17329810060 Contact&Support AboutIEEEXplore ContactUs Help Accessibility TermsofUse NondiscriminationPolicy Sitemap Privacy&OptingOutofCookies Anot-for-profitorganization,IEEEistheworld'slargesttechnicalprofessionalorganizationdedicatedtoadvancingtechnologyforthebenefitofhumanity.©Copyright2022IEEE-Allrightsreserved.Useofthiswebsitesignifiesyouragreementtothetermsandconditions.



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